Apple may make in-house Wi-Fi chips for iPhone 17: What does it mean for users

Apple has been trying to manufacture its own wireless chips to insert into its smartphone universe. After the leak of Apple’s 5G modem in iPhone SE 4, the recent rumour suggested that the iPhone 17 will bring in-house Wi-Fi and Bluetooth chips. Analyst Ming-Chi Kuo posted on X, saying that Apple is planning to switch from Broadcom to its own Wi-Fi chips. He also said that the tech giant expects to move nearly all products to these Wi-Fi chips within about three years, starting with the iPhone 17. The anticipation is that the iPhone 17 will come to town on September 2025. Hence, Apple’s Wi-Fi chips might also debut in the same year.
Additionally, Kuo stated in-house chips will help reduce the cost of the products. Apple developing its own chips could also enhance software integration, but the company already operates within a tightly controlled ecosystem with strong restrictions. Amid ongoing demands for better repairability, proprietary chips might not align with what fans desire.
According to Kuo, this new Wi-Fi chip will be produced using the N7 process, an advanced version of the technology used to manufacture the A13 Bionic chip. Moreover, it will also support the latest Wi-Fi 7 spec, which is used in the iPhone 16 series.
Should Apple’s first in-house chips debut exclusively in the iPhone 17 Pro, they’ll likely expand to the full iPhone 18 lineup later. With the growth of Apple Intelligence, the need for faster speeds and more reliable connectivity is more pressing than ever.
Previously, in 2019, Apple acquired Intel’s modem division with the goal of eliminating its reliance on Qualcomm modems. However, various reports indicate that Apple’s prototype modems have encountered multiple technical issues and setbacks.
At the heart of the iPhone 17 lineup will be Apple’s new A19 chip-the successor to the A18 chip expected to debut with this year’s iPhone 16 series. Speculation is rife that this A19 chip will be produced using a 2-nanometer process by TSMC, the world’s leading semiconductor manufacturer. This new chip is said to bring improvements in performance, energy efficiency, and thermal management. Alongside the A19, the iPhone 17 Pro models are also expected to see a memory upgrade, with reports indicating a jump to 12GB of RAM.
Apple is also reportedly planning to introduce a new type of motherboard in the iPhone 17. This motherboard is rumoured to be developed using Resin Coated Copper (RCC) technology.
The display technology on the iPhone 17 is also expected to see a change. Reports suggest that with the iPhone 17, the displays of Apple’s flagship phone may become even more scratch-resistant, potentially incorporating a new type of glass being developed by Corning. Additionally, there are rumours that Apple might extend the always-on display feature, currently exclusive to the Pro models, to the entire iPhone 17 lineup.